PCB technology services

The Tele and Radio Research Institute has developed and implemented a technology for forming deep micro holes and blind holes in multilayer printed circuit boards with high density connection. This technology was used to produce complex printed circuits while reducing the costs of materials and the price of the final product. As the number of circuit layers increases, the production costs of multilayer boards become several times higher. The density of possible connections increases as well. However, not enough to enable the use of systems with spherical leads with 0.50mm or 0.40mm raster. With the use of micro holes and blind holes which connect several layers of the circuit as well as internal holes in the structures of boards, it is possible to increase the density of connection several times without increasing the number of layers. The boards with such a structure are also considerably cheaper than equivalent (in terms of density of connections) standard boards with through holes.

Basic parameters of the mosaic of circuits – [PDF]

 

 


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