Our operations are oriented towards the needs of the electronics sector and focused on assembly technologies for electronic components, including miniature components such as CSP-type active components, open flip chip semiconductor units and passive components with sizes up to 0201.
Since 1999, the Institute has been conducting research work and training related to SMT and THT lead-free assembly technologies. The Institute conducts research using a series of soldering materials which address the need for increased connection density on printed circuit boards and environmental protection requirements.
Our many years of research experience are used to provide electronic assembly services for a wide range of electronic components. With trained personnel and modern technological equipment, the Centre can guarantee the highest quality of electronic assembly performed using both traditional and lead-free technologies for prototype batches as well as medium and long series.
We can provide you with comprehensive services starting from the design of advanced multilayer printed circuit boards to modern electronic assembly and commissioning of a ready-operating device.
