The ITR’s Research Centre for Electronic Technology has modern equipment with which it can test the quality of soldering materials, printed circuit boards and subassemblies used in the assembly process. It is possible to carry out research on lead-free soldering, assess the quality of solder joints and carry out climate research. The research activities in the accredited area are carried out at the Electronic Product Testing Laboratory No AB045.
Research and services in the accredited area:
- Research into electronic components, printed circuit boards, electronic assemblies:
- Climate research covering a wide range of exposures, temperature shocks;
- thermal exposures (heat or cold – without humidity);
- thermal exposures + humidity;
- frost and dew point test;
- measurements of surface insulation resistance (SIR) in a climatic chamber (thermal exposure + humidity);
- thermal shocks;
- Tests for compliance with RoHS 2 — XRF screening method in accordance with IEC 62321;
- The content of ionic impurities in assemblies and electronic components in accordance with IPC-TM-650 2.3.25 Rev C, p. 6;
- Solderability tests of electronic components and printed circuit boards in accordance with PN-EN 60068-2-54:2009 and PN-EN 60068-2-69:2008;
- Tests for thermal shock resistance and delamination resistance of printed circuit boards in accordance with PN-EN 61189-3:2008 p. 11.2, 11.4;
- Assessment of the correctness of solder joints in accordance with IPC-A-610;
- Assessment of the correctness of printed circuit boards in accordance with IPC-A-600;
- Analysis of the internal structure of printed circuit boards and electronic components on metallographic sections in accordance with IPC-TM-650 Rev E, p. 2.1.1, IPC-A-610 and IPC-A-600;
- X-ray analyses of electronic assemblies, components, BGA systems and other;
- Measurement of the thickness of layers in printed circuit boards (Ni/Au and Sn on Cu).
Research and services outside the accredited area:
- Research into solder joints and solving unusual technological problems;
- Analysis of defects in solder joints and printed circuit boards;
- SEM analyses of materials and solder joints, intermetallic compounds;
- Analysis of contaminants, identification of unknown substances;
- Assessment of soldering processes: on a solder wave, reflow and other soldering;
- Assistance during selection of soldering parameters;
- Solving unusual assembly problems.
- Electronic assembly quality tests
- Decapsulation (internal structure, damage to wire structure and connections) of polymer and metallic package of subassemblies;
- Control of authenticity of electronic subassemblies.
- Tests of materials for electronic assembly
- Analysis of the quality of soldering pastes: wettability, settling, coalescence;
- Analysis of the quality of solder fluxing agents, corrosivity, SIR, electromigration, acid number, non-volatile matter content, presence of halides;
- Analysis of the quality of solder fluxing agents: wettability, surface tension.
- Opinions and analyses for third parties, including insurers, regarding materials, technologies and technological problems encountered during electronic assembly.
Tests are performed according to international and national standards, based on the customer’s guidelines.
- Specialist research equipment
- Scanning electron microscope (SEM) – JEOL JSM-7600 F equipped with an EDX analyser
- X-ray fluorescence (XRF) spectrometer – Fischeroscope X-ray XDV-SD
- X-ray control device – Phoenix Nanome|x
- Solderability tester – Menisco St88 meniscograph
- Device for testing the solderability of printed circuit boards using the ‘rotary immersion’ method
- Omegameter for testing ionic impurities
- Sirometer for testing surface insulation resistance (SIR)
- Viscosity meter for testing viscosity
- Climatic chambers (temperature, climatic, shock, steam chambers)
- Optical and metallographic microscopes
- Devices for making metallographic sections
- Automatic optical inspection (AOI) system
- Laser drill
- SMT assembly line with VIP70A convection-type furnace
- Flir thermal imaging camera, model A320 with Closeup x2 lens and other as needed
